Bootloader 3.6 Y 4.6 Download

Bootloader 3.6 Y 4.6 Download

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Once the drive has been prepared, you can use the front end Installer to learn more about, find, or download distributions and tools to put on a select drive. The front end will create an organized folder structure and copy each ISO to the drive for you (recommended if you want to the tool to keep track of your installations for removal). It can also create persistent storage files for you and the related .json entry. For example, each Ubuntu based distribution can have its own persistent storage up to 10GB. ;)

For IBM Z, the kernel command-line parameters are stored in the boot entry configuration file because the zipl bootloader does not support environment variables. Thus, the kernelopts environment variable cannot be used.

The ARM Linux TransportSrio source code can be downloaded and built twoways. The transport source code is delivered and built as part ofYocto/bitbake. The source code can also be downloaded and built directlyfrom the GIT repository.

The ARM Linux TransportQmss source code can be downloaded and built twoways. The transport source code is delivered and built as part ofYocto/bitbake. The source code can also be downloaded and built directlyfrom the GIT repository.

MMCSD bootloader is required to boot target using an SD card containingbootloader and application images. When the board is powered ON the ROMbootloader detects the MMCSD bootloader image and loads it to theinternal memory.The bootloader initializes the board, copies theapplication image from SD card to the DDR memory and gives control tothe application.

A flash device interfaced with QSPI is flashed with QSPI bootloader andapplication images. When the board is powered ON the ROM bootloaderdetects the bootloader image from flash device and loads it to theinternal memory. The Bootloader initializes the board, copies theapplication image from QSPI device to the DDR memory and gives controlto the application.

A Serial connection is used for transferring the bootloader binary fromPC to target board through XMODEM protocol. The bootloader on executionprompts for application image to transfer through XMODEM. On providingthe path, the application binary is transferred through serialconnection to DDR memory and the control is passed to application toexecute.

A SPI flash device flashed with MCSPI/SPI bootloader and applicationimages is used for booting the board. When the board is powered ON theROM bootloader detects the bootloader image from flash device and loadsit to the internal memory. The Bootloader initializes the board, copiesthe application image from flash to the DDR memory and gives control tothe application.

NAND flash with bootloader and and application images is used forbooting the board. When the board is powered ON the ROM bootloaderdetects the bootloader image from flash device and loads it to theinternal memory. The bootloader initializes the board, copies theapplication image from flash to the DDR memory and gives control to theapplication.

Bootloading an application from flash into DDR memory as in case of TIevaluation platforms is described as normal operation mode for thebootloader. This is the default behavior of the bootloader and can bebuilt using the following command in starterware.

The location of binaries in offset is configured usingsbl_flash_offset_cfg.h in the bootloader source. Users are required touse TIIMAGE tool to append an header to the binary so that thebootloader knows the location and size of the binary to be loaded.

The AMIC110 DDRLESS platform provides a superset flag to enable all theabove features and build the bootloader. The superset build is invokedusing BUILD_ICSS_DDRLESS_BOOT=yes as shown below:

Please note that when using objcopy the compiler generates a contiguousbinary that gets loaded by the bootloader at the location specified inthe header appended by TIIMAGE boot utility. IF you have some codesections in OCMC or SRAM and some section in DDR the compiler willgenerates a binary that spans across full memory range which would be inorder of MB or even GB size so it is recommended that you create compactbinaries that can be loaded into memory or implement a ELF parser tobootloader memory sections that may be fragmented in the address space.you can also load separate binaries for OCMC sections and DDR memory andload the sections separately

A common issue reported with the ARM GCC compiler is that it appendsHeap section associated with the binary to the binary image used toboot. The Heap section is usually filled with zeros so can causesignificant delay in boot times. Essentially the bootloader will bewriting a bunch of zeros in memory so is inefficient. Following workaround has been used to circumvent the issue

The location at which SBL resides on the flash is predefined by the ROMbootloader spec and so these defaults can`t be changed. However the SBLis a user defined bootloader so many of the defaults can easily bemodified to meet application requirements. For example the flash offsetlocation from which the bootloader reads the application is configuredin the source files located under/packages/ti/boot/sbl/src/

Another way to optimize boot times is to reduce the size of the binarythat needs to be loaded by the bootloader by building the app withoptimization for code size using -Os (GNU GCC) and for -O whenusing TI compilers.

On reset the DSP starts execution with the bootrom which transfersexecution to the secondary bootloader from EEPROM using the I2C slavebus address 0x51. The secondary bootloader loads the application programfrom NAND flash then transfers control to the application. To executethe NAND bootloader you must ensure the DIP switches for your platformare properly configured for I2C Master Boot and address 0x51, ANDthe boot parameter index dip switch should be set to 2 or 3.

On reset the DSP starts execution with the bootrom which transfersexecution to the secondary bootloader from EEPROM using the I2C slaveaddress 0x51. The secondary bootloader loads the application programfrom NOR flash then transfers control to the application. To execute theNOR bootloader you must ensure the DIP switches for your platform areproperly configured for I2C Master Boot and address 0x51, AND the bootparameter index switch should be set to 0 or 1.

On reset the DSP starts execution with the bootrom which transfersexecution to the secondary bootloader from EEPROM using the I2C slaveaddress 0x51. The secondary bootloader loads the application programfrom a remote TFTP server then transfers control to the application. Toexecute the EMAC bootloader you must ensure the DIP switches for yourplatform are properly configured for I2C Master Boot and address 0x51,AND the boot parameter index switch should be set to 4. By default EMACboot only supports a BBLOB image format, if the customer wants to bootan ELF image, the IBL configuration table needs to be modified andre-programmed to EEPROM.

TI Technical documentation like Technical reference manual (AMXXdevices), Bootloader USer guide (for C66x/K2X devices) and BootloaderApplication notes for OMAPLxx/C674x list default behavior or the ROMbootloader and limitations and constraints for each boot mode.Application developers need to account for this while designing theirsystem to ensure smooth bring up process.

If you don`t see your bootloader executing post boot, a good sanitycheck is for you to look at the map file for the bootloader and ensurethat the entry point matches with the location in the TI or GPHeader inthe boot image. this can be done by looking at the entry point in theMLO/_ti.bin/GPheader and ensure that it matches with the location ofsymbol Entry in the .out/map file for the bootloader.

The Processor SDK bootloader ships with DDR clock and timing settingsthat apply to the external memory devices that have been used in TIevaluation platforms. When running the code on custom platforms, usersmay be required to change these setting to match the timings required bycustom design. We highly recommend that users create a GEL scriptsimilar to one provided by TI and test the memory interface with the newsettings before using them in the secondary bootloader to setup externalmemory. **Processor SDK Diagnostics**provides a mem_test that can be used to test read and writes to theentire DDR address space for confirming the SOC EMIF settings.

The processor SDK RTOS bootloader is like any other application that canbe loaded over the emulator and debugged. Steps to connect an emulatorto the EVM have been described in the **Hardware Setup Guides**that is linked to the Processor SDK RTOS documentation.

Loading the bootloader over emulator can be very useful step indebugging the system boot. Before generating the final binary forbootloader, the build generates the .out file for the bootloader whichis then formatted in a boot format that the ROM bootloader(RBL) caninterpret. This .out can be loaded over the emulator similar to anyother application. If you load the debug version of the bootloader, youcan single step through the code that initializes the SOC and also partof the SBL code that loads the app from the boot media.

A useful data point for TI to debug boot related issues is to isolatecommonly known initialization and to understand how far the bootloaderhas executed correctly before it runs into any issues. Users arerequired to capture ARM/DSP clocks, Program counter value, Entry pointsdetected, pinmux configuration and confirm DDR initialization and slavecore states. This helps minimize the number of variables in the systemboot and helps us zero in on the most likely cause for the boot failure.

The Multi Proc Manager Linux module is used to load and run DSP imagesfrom ARM Linux user space. The download and run operations can beexercised by using user space API calls. MPM also provides a MPM ClientApplication which can be used to load and run DSP through command line.

You have to choose to download either the 32 bit or 64 bit Arm cross-toolchain, according to the architecture of your Computer on Module SoC. Select the correct one from the tabs below: 2b1af7f3a8